series description
Download pdf version
view demoboard
request sample / quote971-SLT-SMD 5.00 mm (0.197 in) Spacing - 2-12 poles Print this page
Description
- U.S. Pat.6,224,399B1
- Pinstrip
- Low profile
- Exceptional pin retention force on SMT
Typical resistance to horizontal peel off force per 2 poles: 15 kgf (33 lbf), per 6 poles: 28 kgf (61 lbs) (depending on soldering process).
Technical Data
Center to Center Spacing: 5.000 mm (0.197 in)
Bill of Materials
Molding : HT Polyamide, Self extinguishing UL 94, V-0
Color : Black
Temperature limits : Short Time : 260°C (500°F)
Continuous : 105°C (221°F)Low Limit : -40°C (-40°F)
Ambient Temp. Range (°C) : -40°C to 40°C
Comparative Tracking Index : CTI ≥ 250 V
Oxygen Index Rating : 37 %
Average weight per pole: 0.16 g
Solder Pin: Tin plated copper alloy ?1.1 mm (0.04 in.)
Visual Description
- RoHS WEEE Pb free surface compliant
Plug-In Direction Perpendicular to PCB and Wire Entrance Parallel to PCB
-
TYPE 115-F-1115.00 mm spacing - 2-12 poles
-
TYPE 115-F-2115.00 mm spacing - 2-12 poles
-
TYPE 950-FL-DS5.00 mm spacing - 2-24 poles
-
TYPE 950-NAF-DS5.00 mm spacing - 2-12 poles
-
TYPE 950-NLFL-DS5.00 mm spacing - 2-12 poles
-
TYPE 950-RNF-DS5.00 mm spacing - 2-12 poles
-
TYPE 950-T-FL-DS5.00 mm spacing - 2, 3, 8 poles
-
TYPE 958-NLFL-DS5.00 mm spacing - 2-12 poles